Emerson 3051S Specifications Page 161

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Reference Manual
00809-0100-4001, Rev JA
Appendix A: Reference Data
November 2012
Specifications and reference data
M
(1)
Low-Power, 1–5 Vdc with Digital Signal Based on HART Protocol •• ••
W Profibus – PA
•• ••
Code Process Connection HD HG
Process Flange Material Drain/Vent
2 SST SST •• ••
7
(2)
SST Alloy C-276
•• ••
Code Process Isolating Diaphragm HD HG
2 316L SST •• ••
3
(2)
Alloy C-276 •• ••
5 Tantalum
•• ••
Code O-ring Material HD HG
Expanded
A Glass-Filled PTFE •• ••
Code Process Fill Fluid HD HG
Expanded
D D.C. 200 Silicone •• ••
H Inert •• ••
N Neobee M-20
•• ••
P Propylene glyco/water •• ••
Code Sensor Module Isolator Material HD HG
Expanded
2 316L SST •• ••
Code Sensor Module Fill Fluid HD HG
Expanded
1 Silicone •• ••
2 Inert fill (Halocarbon) •• ••
Code Housing Material Conduit Entry Size HD HG
Expanded
A Polyurethane-covered Aluminum ½–14 NPT
B Polyurethane-covered Aluminum M20 × 1.5 (CM20)
••
D Polyurethane-covered Aluminum
••
J SST ½–14 NPT
K SST M20 × 1.5 (CM20)
••
M SST
•• ••
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